Conduction Cooling

CONDUCTION COOLING systems

Custom Design of each system based on Common Approaches of appropriate standard (Manufacture and Maintenance)
Used for Ruggedized flexible solutions (IP65-67)
Allow using High performance modules in systems for high temperatures of operation (up to 70ºC)
Reliability

COM Express PC/104-plus StackPC-PCI CPCI Serial

Target application

-40/+70 ºС		EN50155, EN60068
10/100/150g Vibration/Shock		EN61373
	IP65-67, IK08-IK10	IEC60529, EN62262
Salt mist		EN60068
Damp Heat		EN60068
	EMC (Electromagnetic compatibility)	IEC61000

Choose your form factor

COMPACT PCI SERIAL	STACKABLE PC StackPC

PICMG CPCI-S Standard picmg.org	StackPC Standard www.stackpc.org

CPCIs PICMG

Conductive cooling assembly (CCA)

CCA FRAME (1st Part of CCA assembly)

Front Board Cassete dimensions which cover PCB
CARD Retainer (Wedge Locks)
Ejectors
Board Pitch 5HP

CCA ENCLOSURE (2nd Part of CCA assembly)

Card Retainer Channel width
Backplane position
Board Pitch 5HP

CCA Enclosure

Enclosure surface works as System Heatspreader

CCA Frame surface works as module Heatspreader

CCA ENCLOSURE DEFINES:

Card Retainer Channel width
Backplane position
Board Pitch 5HP
Usually custom design according to customer system requirements

CPCI-serial modules

Each CPCI module has one or few hot components that should fit CCA Frame

Main idea is to dissipate power along the frame to it’s edges

Main difficulty to provide good cooling solution is chips tolerances

Each chip has it’s surface roughness and flatness

Fastwel modules has adjustable Heatspreader part with heat pipes inside for high performance modules

Heat dissipation model

CPC510 HEAT DESSIPATION RESEARCH – HEATSPREADER FIT

What happen if Heatspreader fits CPU chip only by 2/3 of its square?

StackPC Conduction Cooling Solution

Host CPU and Power modules:

One way stack only (StackUP)
Bottom side for Heatspreader
Bottom side for HOT and tall components
Mass production modules adaptation
Cost effective solution

Heatplate provides path for power dissipating along Heatplate to it’s edges and then to enclosure

Expansion modules:

Regular modules dimensions like PC104
Top side for Heatspreader
Top side for HOT components
Mass production modules adaptation
Cost effective solution

Stack with Conduction cooling:

Regular Stack – any position of stack inside enclosure
Regular modules – availability of adding regular modules without heatplates to conduction cooled stack
Modules with Conduction Cooling – common approaches for adding heatplates to Power, CPU and Peripheral modules
Common Heat plates – the same heatplate shape and fix method
Flexibility – all stackable modules benefits with conduction cooling feature
Easy to manufacture – just screw wedge locks, easy access to I/O connectors, easy maintenance