CPC512
3U CompactPCI Intel IvyBridge (2/4 Cores) CPU board
CPC512
• Intel IvyBridge (2/4 Cores)
• RAM: DDR3 SDRAM 1333, 1600 MHz or DDR3L SDRAM 1066,
• 1333 MHz with ECC up to 8GB soldered, 2-channel
• FRAM: 32x KB, 1 KB of which represent a closed area for storing Bios Setup settings; implemented on SPI FPGA bus
• FLASH BIOS: 2 х 32 Mbit SPI-Flash
• Power supply: Supply voltage: +12V, +5V_STBY (optional)
• Operating temperature range: –40…+85°С (according to IEC 60068-2-14)
• Single/Multiple shock resistance:
• 100g (according to IEC 60068-2-27) /50g (IEC 60068-2-29)
• Supported OS: Windows 7 Embedded, Linux 2.6, QNX 6.5.0
• RAM: DDR3 SDRAM 1333, 1600 MHz or DDR3L SDRAM 1066,
• 1333 MHz with ECC up to 8GB soldered, 2-channel
• FRAM: 32x KB, 1 KB of which represent a closed area for storing Bios Setup settings; implemented on SPI FPGA bus
• FLASH BIOS: 2 х 32 Mbit SPI-Flash
• Power supply: Supply voltage: +12V, +5V_STBY (optional)
• Operating temperature range: –40…+85°С (according to IEC 60068-2-14)
• Single/Multiple shock resistance:
• 100g (according to IEC 60068-2-27) /50g (IEC 60068-2-29)
• Supported OS: Windows 7 Embedded, Linux 2.6, QNX 6.5.0
Overview
Downloads
Order Info
Sales & technical support
CPC512 CPU module is a highly integrated 3U CPCI Serial solution for the use in real-time, automation control, high-speed data acquisition and processing systems. The board is based on the Intel Ivy Bridge CPU (2- or 4-core CPUs) which has one of the highest performance level in its class. Reliable operation of CPC512 enables its use in mission critical applications.
Datasheets:
- CPC512 03.pdf(PDF 0.75 MB)
- MIC584.pdf(PDF 0.37 MB)
CPC512-UM.pdf
(PDF 3.47 MB)
| CPС512-01-i72C1.7-RAM4096-R2-I |
Dual Core CPU 1.7 GHz, 17 W, 4GB RAM, with high heatsink, 8HP |
| CPC512-01-I74C2.1-RAM8192-R1-C |
Quad Core CPU 2.1 GHz, 35 W, 8GB RAM, with low copper enhanced-area heatsink, 4HP |
| CPC512RC-01 |
Dual Core CPU 1.7 GHz 17 W, RAM: 4GB, conduction cooling implementation, 5HP |
| CPC512RC-02 |
Quad Core CPU 2.1 GHz 35 W, RAM: 8GB, conduction cooling implementation, 5HP |
| Options: | |
| \Coated Conformal coating | |
| \OEM with a limited package contents | |
| \LNX Linux 2.6 | |
| \Win7e Windows 7 Embedded | |
| Extension Capabilities: | |
| MIC584 interface module | |
Components for embedded systems design
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